Exploiting DEM to Link Thermal Conduction and Elastic Stiffness in Granular Materials
Author(s): |
Tokio Morimoto
Catherine O’Sullivan David M. G. Taborda |
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Medium: | journal article |
Language(s): | English |
Published in: | Journal of Engineering Mechanics (ASCE), February 2022, n. 2, v. 148 |
DOI: | 10.1061/(asce)em.1943-7889.0002054 |
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data sheet - Reference-ID
10636772 - Published on:
30/11/2021 - Last updated on:
30/11/2021