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Experimental thermal performance of wallboard with hybrid microencapsulated phase change materials for building application

Author(s):







Medium: journal article
Language(s): English
Published in: Journal of Building Engineering, , v. 28
Page(s): 101051
DOI: 10.1016/j.jobe.2019.101051
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.jobe.2019.101051.
  • About this
    data sheet
  • Reference-ID
    10377599
  • Published on:
    05/11/2019
  • Last updated on:
    14/11/2019
 
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