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Embedded FBGs and 3-D DIC for the stress analysis of a structural specimen subjected to bending

Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2009.04.033.
  • About this
    data sheet
  • Reference-ID
    10456570
  • Published on:
    23/10/2020
  • Last updated on:
    23/10/2020
 
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