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Dual challenges of heat wave and protective facemask-induced thermal stress in Hong Kong

Author(s):
ORCID


Medium: journal article
Language(s): English
Published in: Building and Environment, , v. 206
Page(s): 108317
DOI: 10.1016/j.buildenv.2021.108317

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Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.buildenv.2021.108317.
  • About this
    data sheet
  • Reference-ID
    10628474
  • Published on:
    05/09/2021
  • Last updated on:
    14/09/2021
 
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