Design of initiating explosives for semiconductor bridge Primer for rapid-fire projectiles

Based on SCB (semiconductor bridge) chip technology, this paper designs a semiconductor bridge ignition component in the standard primer shell, and designs a primer prototype for the high instantaneous, high safety, and high consistency ignition requirements of the current rapid-fire projectiles for the primer of pyrotechnics. First of all, the design and study of a high instantaneous, insensitive SCB chip can meet the safety of 1A1W5min without fire, while reducing the fire time and fire energy; secondly, the research on the packaging technology of SCB chips is carried out. Combined with PCB or ceramic parts, a flat package structure is designed and matched with the standard primer structure. At the same time, the design and performance test of the semiconductor bridge primer for rapid-fire projectiles has been completed. The results show that the action time of the prototype the integrated primer is ≯200µs, and the dispersion is ≯30µs; compared with the current electric primer product, its safety, instantaneousness, and action time are more consistent, and the overall performance is better.