Application of 3D electronic speckle pattern interferometry for the analysis of thermal response in printed circuit boards
| Author(s): |
Pedro J. Sousa
Fernando Carneiro Nuno Viriato Ramos Francisco Barros Mário A. P. Vaz Paulo J. Tavares Pedro M. G. P. Moreira |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Procedia Structural Integrity, 2019, v. 17 |
| Page(s): | 835-842 |
| DOI: | 10.1016/j.prostr.2019.08.111 |
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10644888 - Published on:
10/01/2022 - Last updated on:
10/01/2022
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