Yitao Zhuang
- Adhesive bond-line degradation detection via a cross-correlation electromechanical impedance–based approach. In: Structural Health Monitoring, v. 15, n. 6 (August 2016). (2016):
- Integrity monitoring of adhesively bonded joints via an electromechanical impedance-based approach. In: Structural Health Monitoring, v. 17, n. 5 (October 2017). (2017):