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The following bibliography contains all publications indexed in this database that are linked with this name as either author, editor or any other kind of contributor.

  1. Zhao, Lingkang / Wei, Peijun / Li, Yueqiu (2023): Flexural waves in thermoelastic higher-order shear micro-plate modelled by spatiotemporal fractional differential. In: Composite Structures, v. 303 (January 2023).

    https://doi.org/10.1016/j.compstruct.2022.116330

  2. Zhao, Lina / Wei, Peijun / Huang, Mengsi / Xu, Yuqian (2022): Electro-Thermo-Mechanical Multiple Fields Coupled Wave Propagation Through Piezoelectric Semiconductor Sandwich Structure. In: Composite Structures, v. 288 (May 2022).

    https://doi.org/10.1016/j.compstruct.2022.115358

  3. Kang, Yonggang / Wei, Peijun / Zhang, Peng / Li, Yueqiu (2022): Effect of fractional interporosity flow on elastic waves propagation through a fluid-saturated double-porosity interlayer. In: Soil Dynamics and Earthquake Engineering, v. 154 (March 2022).

    https://doi.org/10.1016/j.soildyn.2021.107132

  4. Huang, Mengsi / Wei, Peijun / Zhao, Lina / Li, Yueqiu (2021): Multiple fields coupled elastic flexural waves in the thermoelastic semiconductor microbeam with consideration of small scale effects. In: Composite Structures, v. 270 (August 2021).

    https://doi.org/10.1016/j.compstruct.2021.114104

  5. Huang, Yishuang / Wei, Peijun (2021): Modelling the flexural waves in a nanoplate based on the fractional order nonlocal strain gradient elasticity and thermoelasticity. In: Composite Structures, v. 266 (June 2021).

    https://doi.org/10.1016/j.compstruct.2021.113793

  6. Zhang, Peng / Wei, Peijun / Li, Yueqiu (2018): The elastic wave propagation through the finite and infinite periodic laminated structure of micropolar elasticity. In: Composite Structures, v. 200 (September 2018).

    https://doi.org/10.1016/j.compstruct.2018.05.095

  7. Xu, Mingxiu / Gitman, Inna M. / Wei, Peijun / Askes, Harm (2020): Finite element implementation of a multi-scale dynamic piezomagnetic continuum model. In: Computers & Structures, v. 240 (November 2020).

    https://doi.org/10.1016/j.compstruc.2020.106352

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