- (2022): A Novel Data Acquisition System for Obtaining Thermal Parameters of Building Envelopes. In: Buildings, v. 12, n. 5 (24 April 2022).
- (2021): Application of Low-Cost Sensors for Building Monitoring: A Systematic Literature Review. In: Buildings, v. 11, n. 8 (27 July 2021).
- Modelado numérico del comportamiento a pandeo de paneles esbeltos de hormigón armado. Presented at: IV Congreso de la Asociación Científico-Tecnica del Hormigón Estructural - Congreso Internacional de Estructuras, Valencia, 24-27.11.2008. (2008):