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The following bibliography contains all publications indexed in this database that are linked with this name as either author, editor or any other kind of contributor.

  1. Pete, D. J. / Mhaisalkar, S. G. / Helonde, J. B. / Vairagar, A. V. (2012): Electromigration-induced void evolution in upper and lower layer dual-inlaid Copper interconnect structures. In: Advances in Materials Research, v. 1, n. 2 (June 2012).

    https://doi.org/10.12989/amr.2012.1.2.109

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