Hisakazu Horii
- (2022): Fabrication of a device testing bonded joint strength under combined stress. Presented at: IABSE Symposium: Challenges for Existing and Oncoming Structures, Prague, Czech Republic, 25-27 May 2022.
- (2021): Experimental study on mechanical behavior of combined joint using adhesives and high strength bolts. Presented at: IABSE Congress: Resilient technologies for sustainable infrastructure, Christchurch, New Zealand, 3-5 February 2021.