Jinshui Dong
- Thermodynamic performance of SiC-enhanced MicroPCM backfill based on response surface methodology. Dans: Case Studies in Construction Materials, v. 20 (juillet 2024). (2024):
- Mechanical and thermo-physical properties of heat and energy storage backfill based on MicroPCMs. Dans: Journal of Building Engineering, v. 83 (avril 2024). (2024):