Large-area electronics combined with integrated circuits into a strain sensing sheets
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Détails bibliographiques
| Auteur(s): |
Yao Yao
(Dept. of Civil and Environmental Engineering, Princeton University, Princeton, NJ, USA)
Shue-Ting Tung (Dept. of Civil and Environmental Engineering, Princeton University, Princeton, NJ, USA) Naveen Verma (Dept. of Civil and Environmental Engineering, Princeton University, Princeton, NJ, USA) Sigurd Wagner (Dept. of Civil and Environmental Engineering, Princeton University, Princeton, NJ, USA) James Sturm (Dept. of Civil and Environmental Engineering, Princeton University, Princeton, NJ, USA) Branko Glisic (Dept. of Civil and Environmental Engineering, Princeton University, Princeton, NJ, USA) |
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| Médium: | papier de conférence | ||||
| Langue(s): | anglais | ||||
| Conférence: | IABSE Conference: Structural Engineering: Providing Solutions to Global Challenges, Geneva, Switzerland, September 2015 | ||||
| Publié dans: | IABSE Conference Geneva 2015 | ||||
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| Page(s): | 1287-1294 | ||||
| Nombre total de pages (du PDF): | 8 | ||||
| Année: | 2015 | ||||
| DOI: | 10.2749/222137815818358574 | ||||
| Abstrait: |
The strain sensing sheet based on Large Area Electronics (LAE) and Integrated Circuits (ICs) is being researched and developed at Princeton University. The prototypes of components of the sensing sheet including LAE interconnect, embedded sensors, batteries, and power harvesters have been created. Behaviour of the sensor exposed to damage has been studied and characterized. Probabilistic algorithms have been created for both data interpretation and evaluation of probability of detection. Small-scale and large-scale tests have been successfully carried out in order to evaluate the concept of the strain sensing sheet and understand its behavior under conditions of damage occurrence and propagation. The concept of the strain sensing sheet, test results, and its current state of advancement are presented in this paper. |
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