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Using Construction and Demolition Waste Materials to Develop Chip Seals for Pavements

Auteur(s): ORCID
ORCID

Médium: article de revue
Langue(s): anglais
Publié dans: Infrastructures, , n. 5, v. 8
Page(s): 95
DOI: 10.3390/infrastructures8050095
Abstrait:

Construction and demolition waste (CDW) materials account for a considerable part of waste materials throughout the world. As these materials are not usually recycled, reusing them in construction projects is of major significance. In this study, recycled concrete, bricks, and glass were used as 100% aggregates of chip seal, which is a corrective or preventive pavement maintenance method. A cationic rapid setting (CRS-2) bitumen emulsion was also used to prepare the chip seal. Different tests, including the sand patch test, sweep test, British pendulum tester (BPT), interface bond, and Vialit test, were conducted. The results of these tests revealed that all these materials had sufficient aggregate embedment for vehicle speeds of more than 70 km/h, and the number of chips was less than 10%, indicating their good performance. All developed chip seals ranked as high skid resistance pavement at ambient temperature. The chip seals developed with concrete and glass showed the best adhesion with an asphalt pavement surface and an aggregate–bitumen adhesion at very cold and ambient temperatures due to the fact of their chemical compositions. Overall, using concrete aggregates to develop chip seals under different traffic loads is recommended. Finally, these findings can provide a novel approach for recycling CDW materials with low costs.

Copyright: © 2023 the Authors. Licensee MDPI, Basel, Switzerland.
License:

Cette oeuvre a été publiée sous la license Creative Commons Attribution 4.0 (CC-BY 4.0). Il est autorisé de partager et adapter l'oeuvre tant que l'auteur est crédité et la license est indiquée (avec le lien ci-dessus). Vous devez aussi indiquer si des changements on été fait vis-à-vis de l'original.

  • Informations
    sur cette fiche
  • Reference-ID
    10730856
  • Publié(e) le:
    30.05.2023
  • Modifié(e) le:
    01.06.2023
 
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