Thermally stable multi-directional magnetoelectric based embedded magnetic sensor
Auteur(s): |
Amritesh Kumar
J. Arout Chelvane A. Arockiarajan |
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Médium: | article de revue |
Langue(s): | anglais |
Publié dans: | Smart Materials and Structures, 2 mars 2023, n. 4, v. 32 |
Page(s): | 045012 |
DOI: | 10.1088/1361-665x/acbf8e |
Abstrait: |
Owing to the multifunctional behavior possessed by magnetoelectric (ME) composites, they are sought-after materials for various magnetic field sensing applications. This article proposes a three-directional ME-based embedded magnetic sensor that has been fabricated using the press-fit technique. The employed fabrication method negates the use of epoxy in the ME sensor, thus enabling its use at elevated temperatures in excess of 100 ∘C. The fabricated sensor is tested using an experimental setup capable of producing ac and dc bias magnetic fields in three coordinate directions. Experiments are performed for various dc magnetic field conditions, including x, y, z directions, their simultaneous combinations, and magnetic field aligned at an angle with the sensor. Under all testing conditions, the embedded sensor shows a significantly high output voltage response. Additionally, the effect of the magnetic field generated by the double magnet system and single magnet system on the sensor performance has also been demonstrated, wherein the embedded sensor is observed to be marginally affected by magnetic field due to the presence of only one magnet. Finally, quasi-static ME measurements are performed at elevated temperatures up to 100 ∘C, and it is observed that the novel embedded sensor has reliable sensing capabilities in aggravated thermal environments even in excess of 100 ∘C. Thus, the proposed three-directional embedded magnetic sensor offers reliable response under all conditions of magnetic field and temperature and can thus be a reliable alternative for the traditionally used layered-based counterparts. |
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sur cette fiche - Reference-ID
10707636 - Publié(e) le:
21.03.2023 - Modifié(e) le:
21.03.2023