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Thermal Performance Assessment of Envelope Retrofits for Existing School Buildings in a Hot–Humid Climate: A Case Study in Chennai, India

Auteur(s): ORCID



Médium: article de revue
Langue(s): anglais
Publié dans: Buildings, , n. 4, v. 13
Page(s): 1103
DOI: 10.3390/buildings13041103
Abstrait:

This study aims to propose building envelope retrofit packages for existing naturally ventilated school buildings in the hot–humid climatic region of Chennai, India. Indoor thermal parameters were collected through field studies from nine sample classrooms of a selected school building in May 2019, between 9.00 am and 4.00 pm. The thermal performance assessment of the existing building was performed by examining the discomfort hours using the CBE thermal comfort tool. Envelope retrofit strategies gathered from the literature and building standards were applied and studied through simulation. The findings reveal the enormous potential to increase the thermal comfort of existing school buildings through envelope retrofit measures. The results demonstrate that the whole-building temperature can be reduced up to 3.2 °C in summer and up to 3.4 °C in winter. Implementing retrofit measures to the building envelopes of existing buildings will help school owners to increase the comfortable hours of whole buildings by up to 17%. In comparison, annual energy savings of up to 13% for the whole building can be made by enhancing the thermal performance of the building envelope. The findings will also help architects to optimise thermal performance and energy usage with minimal interventions.

Copyright: © 2023 by the authors; licensee MDPI, Basel, Switzerland.
License:

Cette oeuvre a été publiée sous la license Creative Commons Attribution 4.0 (CC-BY 4.0). Il est autorisé de partager et adapter l'oeuvre tant que l'auteur est crédité et la license est indiquée (avec le lien ci-dessus). Vous devez aussi indiquer si des changements on été fait vis-à-vis de l'original.

  • Informations
    sur cette fiche
  • Reference-ID
    10728071
  • Publié(e) le:
    30.05.2023
  • Modifié(e) le:
    01.06.2023
 
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