Thermal comfort and energy saving of novel heat-storage coatings with microencapsulated PCM and their application
| Auteur(s): |
Xiaoyun Zhu
Xinxin Sheng Jun Li Ying Chen |
|---|---|
| Médium: | article de revue |
| Langue(s): | anglais |
| Publié dans: | Energy and Buildings, novembre 2021, v. 251 |
| Page(s): | 111349 |
| DOI: | 10.1016/j.enbuild.2021.111349 |
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sur cette fiche - Reference-ID
10625902 - Publié(e) le:
26.08.2021 - Modifié(e) le:
26.08.2021
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