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Moisture Ingress in Building Envelope Materials: (I) Scientometric Analysis and Experimental Fundamentals

Auteur(s): ORCID
ORCID

ORCID
ORCID
ORCID



Médium: article de revue
Langue(s): anglais
Publié dans: Buildings, , n. 5, v. 15
Page(s): 798
DOI: 10.3390/buildings15050798
Abstrait:

Moisture ingress is a critical concern in buildings, as it may profoundly affect structural integrity, the energy efficiency of a building, and as well the quality of the indoor environment that, in turn, could influence the health and safety of building occupants. Moisture ingress can occur during any phase in the lifecycle of a building component, where environmental loads, such as precipitation, wind, snow, and elevated relative humidity, play a fundamental role in affecting the building structure. Climate change exacerbates the issue of moisture ingress by intensifying these loads. In this review paper, the statistical perspective on publications related to moisture ingress in building envelope materials (BEMs) was first assessed through a scientometric study. All relevant publications were gathered and manually filtered, and the selected papers were categorized based on the topics discussed. The results of the scientometric study, as presented in this paper, include a bar chart in which the number of publications in each category is illustrated; a science journal mapping diagram showing the interdisciplinary connections of the research; a cluster map depicting the network between topics; and an R&D momentum analysis reflecting the rate of growth and publication count in this field. Given the strong focus on material properties, this review also examines experimental methods for characterizing moisture transport properties in building materials used in BEMs. Additionally, the differences between various codes and standards centered on this topic are reviewed and discussed. This combined strategy is intended to comprehensively evaluate available information and approaches to permit identifying the knowledge gaps that need to be addressed.

Copyright: © 2025 by the authors; licensee MDPI, Basel, Switzerland.
License:

Cette oeuvre a été publiée sous la license Creative Commons Attribution 4.0 (CC-BY 4.0). Il est autorisé de partager et adapter l'oeuvre tant que l'auteur est crédité et la license est indiquée (avec le lien ci-dessus). Vous devez aussi indiquer si des changements on été fait vis-à-vis de l'original.

  • Informations
    sur cette fiche
  • Reference-ID
    10820889
  • Publié(e) le:
    11.03.2025
  • Modifié(e) le:
    11.03.2025
 
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