From aggregate to particleboard: A new multi-scale model approach to thermal conductivity in bio-based materials
Auteur(s): |
S. Rosa Latapie
M. Lagouin V. Sabathier A. Abou-Chakra |
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Médium: | article de revue |
Langue(s): | anglais |
Publié dans: | Journal of Building Engineering, novembre 2023, v. 78 |
Page(s): | 107664 |
DOI: | 10.1016/j.jobe.2023.107664 |
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sur cette fiche - Reference-ID
10757121 - Publié(e) le:
14.01.2024 - Modifié(e) le:
14.01.2024