Fabrication and simulation study for vertical micro-TEGs based on printed circuit board manufacturing processes
Autor(en): |
Negin Sherkat
Athira Kattiparambil Sivaprasad Uwe Pelz Peter Woias |
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Medium: | Fachartikel |
Sprache(n): | Englisch |
Veröffentlicht in: | Smart Materials and Structures, 30 August 2022, n. 10, v. 31 |
Seite(n): | 104003 |
DOI: | 10.1088/1361-665x/ac8dcd |
Abstrakt: |
The development of fabrication procedures for micro-thermoelectric generators (µTEGs) based on low-cost fabrication technologies, appropriate for mass production is discussed and demonstrated in this study. Simulations were carried out, two manufacturing processes were tested, and device performance is compared to simulation results for vertical µTEGs. The substrate for this device is a printed circuit board, and the thermoelectric materials are self-developed Bi0.5Sb1.5Te3(p-type) and Bi2Te2.7Se0.3(n-type) pastes. A square µTEG (15 mm × 15 mm × 500 µm) with eight thermocouples (TCs) was fabricated. The characterization of the fabricated 8-TC-µTEG was carried out and a power output of 1.23 µW was obtained for the fabricated 8-TC-µTEG. The measurement results of this 8-TC-µTEG closely match simulation results as well. Moreover, a novel vertical electrical contact resistance measurement setup is designed and implemented into the final evaluation of µTEG production to have a more accurate assessment. The simulation study is also applied for the designed electrical contact resistance measurement setup. As a result, the contact resistivity of Bi2Te3/Cu was calculated as 5.65 × 10−4Ωcm². |
Copyright: | © 2022 Negin Sherkat, Athira Kattiparambil Sivaprasad, Uwe Pelz, Peter Woias |
Lizenz: | Dieses Werk wurde unter der Creative-Commons-Lizenz Namensnennung 4.0 International (CC-BY 4.0) veröffentlicht und darf unter den Lizenzbedinungen vervielfältigt, verbreitet, öffentlich zugänglich gemacht, sowie abgewandelt und bearbeitet werden. Dabei muss der Urheber bzw. Rechteinhaber genannt und die Lizenzbedingungen eingehalten werden. |
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23.09.2022 - Geändert am:
07.02.2024