Advances in Materials Research (AMR) - v. 1, n. 2 (Juni 2012)
| Erschienen: | Juni 2012 |
|---|
Artikel in dieser Ausgabe
| Autor(en) | Titel | Seite(n) |
|---|---|---|
| Pete, D. J. / Mhaisalkar, S. G. / Helonde, J. B. / Vairagar, A. V. | Electromigration-induced void evolution in upper and lower layer dual-inlaid Copper interconnect structures | 109-113 |
| Mahendran, G. / Balasubramanian, V. / Senthilvelan, T. | Mechanical and metallurgical properties of diffusion bonded AA2024 Al and AZ31B Mg | 147-160 |
| Kumar, Vinod / kumari, Neelam | Modeling and multiple performance optimization of ultrasonic micro-hole machining of PCD using fuzzy logic and taguchi quality loss function | 129-146 |
| Hosseini, Seyed Hossein / Majidpour diz, Mohammad | Preparation and characterization of nanoflake composite multi core-shell SrFe₁₂O19/Fe₃O₄/PEG/PPy | 161-168 |
| Nath, K. Amar / Prasad, K. | Structural and electrical properties of perovskite Ba(Sm)1/2Nb1/2O₃-BaTiO₃ceramic | 115-128 |
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27.05.2022 - Geändert am:
27.05.2022
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