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Comparison of Fundamental Frequency and Sweep Resistance of Different Wire Loops Using Finite Element Model


Medium: Fachartikel
Sprache(n): Englisch
Veröffentlicht in: International Journal of Structural Stability and Dynamics, , n. 1, v. 15
Seite(n): 1450032
DOI: 10.1142/s0219455414500321

Wire loop resistance is critical for microelectronic packaging because it directly influences the reliability of the product. Proposed herein is an effective method for predicting the resistance of a wire loop. A finite element (FE) model is developed for verifying the method. The wire geometry is modeled based on actual wire profiles captured with a high-speed camera. Based on this model, the effects of wire properties, residual stresses, loop shape and loop type on the wire loop resistance are studied. Simulations demonstrated that the shape of the loop could dramatically alter the wire loop resistance. On the other hand, the wire properties, residual stresses and loop type mildly affect the wire loop resistance. The standard loop is the more resistant loop than the N and M loops. By using a large and hard wire, moderately tensioning the wire loop and reducing the loop span, height and number of kinks, one can improve the wire loop resistance. This study should provide useful insights into loop design for modern microelectronic packaging.

Structurae kann Ihnen derzeit diese Veröffentlichung nicht im Volltext zur Verfügung stellen. Der Volltext ist beim Verlag erhältlich über die DOI: 10.1142/s0219455414500321.
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