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Surface modification as a technique to improve inter-layer bonding strength in 3D printed cementitious materials

Autor(en):


Medium: Fachartikel
Sprache(n): en 
Veröffentlicht in: RILEM Technical Letters, , v. 4
Seite(n): 33-38
DOI: 10.21809/rilemtechlett.2019.84
Abstrakt:

The structural capacity of 3D printed components mainly depends on the inter-layer bonding strength between the different layers. This bond strength is affected by many parameters (e.g. moisture content of the substrate, time gap, surface roughness,..) and any mismatch in properties of the cementitious material may lead to early failure. A common technique to improve inter-layer bonding strength between a substrate and a newly added layer is modifying the substrate surface. For the purpose of this research, a custom-made 3D printing apparatus is used to simulate the printing process and layered specimens with a different delay time (0 and 30 minutes) are manufactured with different surface modification techniques (wire brushing, addition of sand or cement and moisturizing substrate layer). The surface roughness was measured and the effect of the modification technique on the inter-layer-bonding strength was investigated. Results showed that the most effective way to increase the inter-layer bonding is increasing the surface roughness by a comb. This creates a kind of interlock system that will provide a higher inter-layer strength. The compressive strength is most influenced by the addition of cement, where the changing W/C-ratio will create a higher degree of hydration and consequently a higher strength.

Lizenz:

Dieses Werk wurde unter der Creative-Commons-Lizenz Namensnennung 4.0 International (CC-BY 4.0) veröffentlicht und darf unter den Lizenzbedinungen vervielfältigt, verbreitet, öffentlich zugänglich gemacht, sowie abgewandelt und bearbeitet werden. Dabei muss der Urheber bzw. Rechteinhaber genannt und die Lizenzbedingungen eingehalten werden.

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  • Reference-ID
    10412159
  • Veröffentlicht am:
    08.02.2020
  • Geändert am:
    08.02.2020