Study on headed shear studs influencing the interfacial bond behaviour in CFST columns
Autor(en): |
Partha Pratim Debnath
(The Hong Kong Polytechnic University Kowloon Hong Kong)
Junbo Chen (Huazhong University of Science and Technology Wuhan China) Amit H. Varma (Purdue University, West Lafayette Indiana USA) Tak‐Ming Chan (The Hong Kong Polytechnic University Kowloon Hong Kong) |
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Medium: | Fachartikel |
Sprache(n): | Englisch |
Veröffentlicht in: | ce/papers, September 2023, n. 3-4, v. 6 |
Seite(n): | 72-77 |
DOI: | 10.1002/cepa.2368 |
Abstrakt: |
The performance of concrete‐filled steel tubular (CFST) columns with headed shear studs under push‐out loading has been investigated. The primary objective of the research programme was to investigate the bond behaviour between the steel tube and the infill concrete core of the square CFST column. A numerical investigation has been carried out using the commercially available finite element software. For the simulated numerical models, they have been initially validated with existing experimental results. The validations were made in terms of failure modes, bond strength‐slip curves and the initial stiffness. The validated models were further used to carryout parametric studies. The parameters studied include, vertical spacing of shear studs, horizontal spacing of shear studs, and CFST cross‐section slenderness. From the investigation, it is observed that with reduced vertical spacing of studs, the bond strength increases significantly. Specimens having horizontal spacing of studs as width/4 has more bond strength than specimen with horizontal spacing of width/2 and 0. For specimens with reduced vertical and horizontal spacing of studs though leads to higher bond stress, but also drops suddenly due to loss of contact between the stud and concrete. Therefore, 70% of the peak stress value may be considered as the achieved bond stress, as this stress value sustains for higher slip values. Lastly, as the column cross‐section slenderness reduces, there is a trend in increase in interfacial bond strength. |
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10767401 - Veröffentlicht am:
17.04.2024 - Geändert am:
17.04.2024