Smartphone‐based high durable strain sensor with sub‐pixel‐level accuracy and adjustable camera position

Computer vision strain sensors typically require the camera position to be fixed, limiting measurements to surface deformations of structures at pixel‐level resolution. Also, sensors have a service term significantly shorter than the designed service term of the structures. This paper presents research on a high durable computer vision sensor, microimage strain sensing (MISS)‐Silica, which utilizes a smartphone connected to an endoscope for measurement. It is designed with a range of 0.05 ε, enabling full‐stage strain measurement from loading to failure of structures. The sensor does not require the camera to be fixed during measurements, laying the theoretical foundation for embedded computer vision sensors. Measurement accuracy is improved from pixel level to sub‐pixel level, with pixel‐based measurement errors around 8 µε (standard deviation approximately 7 µε) and sub‐pixel calculation errors around 6 µε (standard deviation approximately 5 µε). Sub‐pixel calculation has approximately 30% enhancement in measurement accuracy and stability. MISS‐Silica features easy data acquisition, high precision, and long service term, offering a promising method for long‐term measurement of both surface and internal structures.